Handset Design Techniques at the Package and System Level
نویسنده
چکیده
Silicon integration has delivered tremendous cost, space and power savings across a wide variety of consumer electronics products, enabling handset designers to meet strong demand for more highly integrated wireless semiconductor solutions capable of providing new voice, data and multimedia capabilities without increasing the size, cost or power requirements of next-generation mobile handsets. With the advent of advanced packaging techniques, designers can now bypass traditional steps on the integration curve while maintaining a high degree of flexibility, proven reliability, and guaranteed performance.
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